IMWS-AMP 2017 conference represents a unique and unprecedented opportunity to bring together researchers and practitioners of different background (materials scientists, chemical experts, physicists, microwave engineers and process technologists), to share the most recent advances in new materials and manufacturing processes, which represent the key for the development of future RF, microwave, mm-wave and THz devices, circuits and systems. IMWS-AMP 2017 is financially sponsored by the IEEE Microwave Theory and Techniques Society (MTT-S) and technically co-sponsored by the European Microwave Association (EuMA). The IMWS-AMP 2017 edition will be host by the University of Pavia, Italy. The conference will feature an exciting technical program, an industry exhibit, and invited talks by worldwide recognized experts in materials and manufacturing processes.

Pavia is the capital of the fertile province of Pavia, placed in the south-western Lombardy, northern Italy, 35 kilometres (22 miles) south of Milan. With its population, about 68,000, the city was the capital of the Kingdom of the Lombards from 572 to 774. It is known for agricultural products including wine, rice, cereals, and dairy products. Moreover, it is the home to the ancient University of Pavia (founded in 1361), which together with the IUSS (Institute for Advanced Studies of Pavia) and its colleges belongs to the Pavia Study System. The city possesses many artistic and cultural treasures: its most famous landmark is the Certosa di Pavia, or Carthusian monastery, founded in 1396 and located eight kilometres (5.0 miles) north of the city. Among other notable structures are: the Cathedral of Pavia (Duomo di Pavia), Basilica of San Pietro in Ciel d'Oro ("St. Peter in Golden Sky"), Castello Visconteo, Santa Maria del Carmine and the medieval towers that still shape the town skyline.

The purpose of IMWS-AMP 2017 is to boost technical and educational activities as well as exchanges and collaborations within the international microwave community. Perspective authors are cordially invited to submit papers in all areas of novel material, advanced manufacturing and processing, and integration techniques for microwave to terahertz circuits and system.

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